열 수축 접착 버트 터미널
- 설명
- 문의
Product details:
♦ Operating temperature:-55℃~125℃
♦ Initial shrinkage temperature:80 ℃
♦ The temperature that solder begins to dissolve:138℃
♦ The temperature that solder completely dissolved:160℃
♦ Shrink temperature:>160℃
♦ Dielectric strength:1케이 V
♦ Protection class:IP 67
♦ Application:Specially designed for wire connection, heat shrink protection and water-proof
♦ Property:Easy connection & butt jointing, sealed & water-proof,excellent material & insulation, good electrical conductivity
Item | Item Spec. | Wire Spec. | Wire Range | ||||
A(min.) | L(min.) | B(min.) | B&씨(max.) | 씨(min.) | AWG | mm² | |
S11 | 1.7 | 26 | 1 | 1.7 | 0.76 | 26-24 | 0.25-0.5 |
S21 | 2.7 | 40 | 1.4 | 2.7 | 1.2 | 22-18 | 0.5-1.5 |
S31 | 4.5 | 40 | 2.3 | 4.5 | 2 | 16-14 | 1.5-2.5 |
S41 | 6 | 40 | 3.7 | 6 | 3.4 | 12-10 | 4.0-6.0 |
1> 열수축 튜브
2> Low temperature solder ring
3> Waterproof hot melt glue